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Silicon Potting Adhesive

Price 230.0 INR/ Bottle

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MOQ : 50 Bottles

Silicon Potting Adhesive Specification

Form
Liquid/Paste

Glue thickness
Recommended 2-5 mm

Packaging Size
1 kg, 5 kg, 10 kg

Hardness
Shore D 80-85

Surface Of Application
Metals, plastics, ceramics, PCB

Features
Excellent electrical insulation, moisture resistance, high bond strength

Holding Power
Strong

Tensile Strength
High

Material
Epoxy Resin

Adhesive Type
Two-component epoxy

Storage Temperature
Store in a cool, dry place, 5-25C

Shelf Life
12 months

Types Of Chemical
Epoxy System

Other Names
Epoxy Potting Compound

Usage
Potting and encapsulation of electronic components

Grade
Industrial

Purity
99%

Application
Electrical and electronic insulation, sealing, protection

Color
Black

Physical State
Paste/Liquid

Viscosity
7000-12000 cps at 25C

Thermal Conductivity
0.7 W/mK

Curing Time
24 hours at room temperature or 2-3 hours at 60C

Recommended Pot Life
30-40 minutes at 25C

Tack-Free Time
8-12 minutes at room temperature

Flame Retardancy
UL 94 V-0 compliant

Dielectric Strength
>18 kV/mm

Operating Temperature Range
-40C to +120C

Chemical Resistance
Excellent to acids, bases, and solvents

VOC Content
Low/Compliant with RoHS

Density
1.6 - 1.65 g/cm3

Mix Ratio (Resin:Hardener)
100:10 by weight

Water Absorption
<0.2% after 24 hours

Silicon Potting Adhesive Trade Information

Minimum Order Quantity
50 Bottles

Payment Terms
Cash in Advance (CID)

Supply Ability
5000 Bottles Per Month

Delivery Time
7 Days

Main Domestic Market
All India

About Silicon Potting Adhesive

Discover world-class Black Potting Adhesive at clearance rates with truly competitive pricing. This noteworthy two-component epoxy system is engineered for potting and encapsulation-delivering uncommon electrical insulation for metals, plastics, ceramics, and PCBs. With a mix ratio of 100:10 by weight, rapid curing options (24 hours at room temperature or 2-3 hours at 60C), and exceptional dielectric strength (>18 kV/mm), you'll find its performance ideal for both protection and sealing. Featuring robust chemical resistance, UL 94 V-0 flame retardancy, and a strong bonding profile, this adhesive is a preferred choice for industrial use across India and global markets.

Versatile Applications & Outstanding Features

Black Potting Adhesive is designed for industrial-grade potting and encapsulation of electronic components. Its notable features include excellent moisture resistance, high bond strength, and remarkable electrical insulation. Use it for insulating and sealing metals, plastics, ceramics, and printed circuit boards. With a fast tack-free time, variable curing options, and recommended glue thickness of 2-5 mm, this epoxy adhesive excels in both liquid and paste form, meeting rigorous demands of electrical and electronic sectors effectively.

Export Markets, Packaging, and Certification Details

Black Potting Adhesive serves major export markets worldwide, especially for bulk orders from manufacturers and distributors. Available in packaging sizes of 1 kg, 5 kg, and 10 kg, each batch is processed in accordance with order completion protocols and timely dispatching. Backed by certifications including RoHS compliance and UL 94 V-0 flame retardancy, your purchase orders are supported by assured quality, efficient packaging, and swift delivery, making it the go-to adhesive for international industrial needs.

FAQ's of Black Potting Adhesive:

Q: How should Black Potting Adhesive be mixed for optimal results?

A: To achieve optimal bonding and performance, mix the resin and hardener in a 100:10 ratio by weight. Ensure thorough blending to prevent inconsistencies in curing and insulation.

Q: What are the main benefits of using this potting adhesive for electronic components?

A: This adhesive offers superior electrical insulation, strong moisture resistance, flame retardancy (UL 94 V-0), and outstanding bond strength, effectively protecting sensitive electronics from environmental and chemical stress.

Q: Where can Black Potting Adhesive be applied most effectively?

A: It is best used for potting and encapsulation of electrical and electronic devices, particularly in metals, plastics, ceramics, and PCBs, across industrial and manufacturing environments.

Q: What is the recommended curing process for this adhesive?

A: Cure the adhesive at room temperature for 24 hours or accelerate the process to 2-3 hours at 60C. The recommended pot life at 25C is 30-40 minutes, and tack-free time is 8-12 minutes.

Q: When should the adhesive be applied after mixing?

A: For best results, apply the adhesive within its 30-40 minute pot life window at 25C, ensuring effective spread and bonding before it begins to set.

Q: What certifications and compliance standards does the adhesive meet?

A: This product is RoHS compliant, offers low VOC content, and meets UL 94 V-0 flame retardancy standards, ensuring it adheres to rigorous safety and environmental benchmarks.

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